Copper foil
Kingboard Copper Foil Ltd is one of the largest copper foil manufacturers in China. Their product range includes rough and gelatinized copper foil for use in laminates and printed circuit boards, with thickness ranging from 8 – 105 µm. They are also continuously developing new kinds of copper foil products, including battery copper foils, extremely low peak value copper foils, 2-side processing copper foil and high temperature and high-extensibility copper foils.
Copper Foil in PANELS
Folija je dobavljiva v debelinah 9 µm, 12 µm, 18 µm, 35 µm in 70 µm, v želenih dimenzijah. Gre za HTE material (High Temperature Elongation), primeren za multilayer plošče z visokim Tg in brez halogena.
KB Copper Foil in ROLLS:
“STD” Standard Uncoated Copper Foil
Usage: Suitable for both internal and external parts of copper foil in multi-layer wiring board (FR-4).
Characteristics: High tensile and ductile competence, good bonding strength, heat resistance and corrosion resistance.
“HTE” Uncoated Copper Foil
Usage: Suitable for the internal part of copper foil for multi-layer wiring board (FR-4).
Characteristics: High heat tensile and ductile competence, good bonding strength, heat resistance, corrosion resistance, anti-oxidization.
“LP” Uncoated Copper Foil
Usage: Suitable for the internal part of copper foil for multi-layer wiring board (FR-4).
Characteristics: High heat tensile and ductile competence, good bonding strength, heat resistance, corrosion resistance, anti-oxidization.
Coated Copper Foil
Usage: Suitable for FR-1 paper laminate board. “CTI” adhesive-coated copper foil is suitable for high voltage resistance board.
Characteristics: High heat tensile and ductile competence, heat resistance. CTI Copper Foil is of high voltage resistance.
Battery Copper Foil
Usage: Suitable for negative electrode of lithium cell.
Characteristics: High heat tensile and ductile competence, heat resistance.
